The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Jan. 12, 2023
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Takeo Nakano, Nirasaki, JP;
Hirokazu Ueda, Osaka, JP;
Mitsuaki Iwashita, Nirasaki, JP;
Ryuichi Asako, Nirasaki, JP;
Naoki Umeshita, Tokyo, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 21/67126 (2013.01);
Abstract
A substrate processing method includes: preparing a substrate having a metal film exposed on a surface of the substrate; and forming a film of an ionic self-association material on a surface of the metal film by supplying the ionic self-association material to the surface of the substrate, the ionic self-association material having fluidity with a hydrophilic group and a hydrophobic group.