The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Sep. 27, 2022
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Hirokazu Ueda, Osaka, JP;

Naoki Umeshita, Tokyo, JP;

Toshikazu Akimoto, Tokyo, JP;

Hiroki Maehara, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); B05C 11/10 (2006.01); C23C 16/40 (2006.01); C23C 16/52 (2006.01); C23C 16/458 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45565 (2013.01); B05C 11/1013 (2013.01); C23C 16/402 (2013.01); C23C 16/45544 (2013.01); C23C 16/52 (2013.01); C23C 16/4583 (2013.01);
Abstract

An apparatus for processing a substrate by supplying a processing gas to the substrate in a processing container. The apparatus comprises: a mounting table provided in the processing container and for mounting the substrate; a gas shower head comprising a gas diffusion space provided at a position facing the mounting table and for diffusing the processing gas, and a shower plate having a plurality of gas supply holes for supplying the processing gas diffused in the gas diffusion space to the processing container; a gas supply portion provided to supply the processing gas to the gas diffusion space and having a flow rate adjusting portion for the processing gas; a pressure sensor portion provided in the gas diffusion space and to output a pressure signal corresponding to a pressure measurement value in the gas diffusion space; and a controller to output a control signal for adjusting a flow rate of the processing gas.


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