This inventor holds 104 USPTO granted patents and 2 published patent applications and 3 EPO patents, primarily in Semiconductor Devices (CPC class 257306). Top assignees: Hitachi, Ltd., Kabushiki Kaisha Toshiba, Ricoh Company, Ltd.. Active years: 1987-2025.
Inventors with similar research interests:
Location History:
- Machida, JP (1987)
- Musashimurayama-shi, Tokyo, JP (2001)
- Ohme, JP (1992 - 2005)
- Hamura, JP (1996 - 2005)
- Musasimurayama, JP (2006 - 2008)
- Musashi-murayama, JP (2000 - 2009)
- Kanagawa-ken, JP (1997 - 2010)
- Yokohama, JP (1989 - 2019)
- Tokyo, JP (1999 - 2020)
- Kanagawa, JP (2008 - 2020)
- Yokohama Kanagawa, JP (2018 - 2021)
- Santa Clara, CA (US) (2022)
Company Filing History:
39 out of 42,717 
24 out of 53,226 
13 out of 28,915 
Years Active: 1987-2025
Areas of Expertise:
Title: Innovations of Hideo Aoki in Semiconductor Technology
Introduction
Hideo Aoki is a renowned inventor based in Yokohama, Japan, known for his contributions to semiconductor technology. With an impressive portfolio of 104 patents, Aoki has significantly influenced the field through innovative designs and methodologies. His work, characterized by meticulous engineering and creative solutions, has paved the way for advancements in semiconductor devices.
Latest Patents
Among his most recent patents is a groundbreaking semiconductor device and substrate. This invention features a substrate that incorporates a wire layer and an insulating layer. The wire layer is electrically connected to a semiconductor chip, which is placed over the substrate. The insulating layer is notable for its unique construction, comprising a glass woven fabric that contains resin. This innovative design utilizes glass fibers woven in multiple directions, differing in material, number, and thickness based on their orientation.
Another notable patent by Aoki details a semiconductor device and its manufacturing method. This invention includes a substrate with conductive connection parts arrayed on its first face. The semiconductor chip, facing this substrate, is equipped with connection bumps that link electrically to these conductive parts. The innovation lies in the varying thickness of conductive connection parts arranged in distinct regions on the substrate, enhancing device performance and manufacturing efficiency.
Career Highlights
Aoki has garnered extensive experience working with prominent companies in the technology sector. Notably, he has been associated with Hitachi, Ltd. and Toshiba Corporation, contributing his expertise to their semiconductor divisions. His role in these organizations has not only advanced his personal career but has also facilitated significant technological advancements in semiconductor applications.
Collaborations
Throughout his career, Aoki has collaborated with esteemed colleagues such as Tsuyoshi Tamaru and Isamu Asano. These partnerships have allowed for the exchange of ideas and co-development of innovative technologies, further pushing the boundaries of semiconductor engineering.
Conclusion
Hideo Aoki's extensive patent portfolio and collaborative efforts reflect his dedication to enhancing semiconductor technology. His latest inventions illustrate a profound understanding of material innovation and electrical connectivity, making him a key figure in the ongoing evolution of the semiconductor industry. As the demand for more advanced semiconductor solutions continues to grow, Aoki's contributions will undoubtedly remain influential in shaping the future of technology.