The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2015
Filed:
Mar. 08, 2013
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Hideo Aoki, Kanagawa, JP;
Chiaki Takubo, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 2924/0002 (2013.01);
Abstract
According to one embodiment, a semiconductor module includes a substrate, which has a first surface and a second surface opposite to the first surface, a controller device and a memory device formed on the first surface, and a metal plate bonded on the second surface. The metal plate is formed at least at a portion of the second surface corresponding to the controller device so that heat generated at the controller device conducts away from the memory device.