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For the Inventor, By the Inventor

Tokyo, Japan

Chiaki Takubo

This inventor holds 63 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Technology (CPC class H01L). Top assignees: Kabushiki Kaisha Toshiba, Toshiba Tec Corporation, Sumitomo Electric Industries, Limited. Active years: 1990-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chiaki Takubo. Retrieved from https://idiyas.com/inventor/chiaki-takubo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 63 

% Patents Active = 65.1

Average Co-Inventor Count = 3.5

ph-index = 17

Forward Citations = 908(Granted Patents)

Forward Citations (Not Self Cited) = 890(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Yokohama, JP (1990 - 1998)
  • Kanagawa-ken, JP (1998)
  • Tokyo-to, JP (1998 - 2000)
  • Sumida-ku, JP (2012 - 2013)
  • Tokyo, JP (1998 - 2017)
  • Sumida Tokyo, JP (2017 - 2019)

Company Filing History:

goldMedal60 out of 53,261 
 
Kabushiki Kaisha Toshiba
 patents
silverMedal3 out of 7 
 
Toshiba Tec Corporation
 patents
bronzeMedal2 out of 10,641 
 
Sumitomo Electric Industries, Limited
 patents
4. 1 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents
5. 2 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 1990-2019

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Areas of Expertise:
Semiconductor Device
Manufacturing Method
Electronic Circuit
Optical Semiconductor
Circuit Board
Semiconductor Module
Stacked Type Device
Ball Grid Array
Hybrid Wiring Board
Resin Particle
Testing Apparatus
63 patents (USPTO):Explore Patents
1. 10424542 - Semiconductor device (2019-09-24),
2. 9852995 - Semiconductor device (2017-12-26),
3. 9633902 - Method for manufacturing semiconductor device that includes dividing semiconductor substrate by dry etching (2017-04-25),
4. 9202768 - Semiconductor module (2015-12-01),
5. 9142477 - Semiconductor module (2015-09-22),
6. 8426977 - Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module (2013-04-23),
7. 8338904 - Semiconductor device and method for manufacturing the same (2012-12-25),
8. 8309430 - Semiconductor manufacturing apparatus and semiconductor manufacturing method (2012-11-13),
9. 8237285 - Semiconductor device, through hole having expansion portion and thin insulating film (2012-08-07),
10. 8220147 - Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit (2012-07-17),
11. 7939171 - Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit (2011-05-10),
12. 7932605 - Semiconductor device and manufacturing method therefor (2011-04-26),
13. 7888760 - Solid state imaging device and method for manufacturing same, and solid state imaging module (2011-02-15),
14. 7877871 - Method of manufacturing an electronic circuit formed on a substrate (2011-02-01),
15. 7608911 - Semiconductor device package having a semiconductor element with a roughened surface (2009-10-27),

Title: Chiaki Takubo: Pioneer in Semiconductor Innovations

Introduction

Chiaki Takubo is a distinguished inventor based in Tokyo, Japan, known for his significant contributions to the field of semiconductor devices. With an impressive portfolio of 63 patents, Takubo continues to push the boundaries of technology and innovation.

Latest Patents

Among his latest inventions, Takubo has developed a series of innovative semiconductor devices. One notable patent describes a semiconductor device that includes a first semiconductor chip with a semiconductor element on its first surface and an opposing second surface. This design features a first metal layer that supports the chip, with specific dimensions ensuring optimal performance. The device includes a resin layer and via contacts that connect to interconnects, showcasing Chiaki's expertise in integrating materials and components for advanced circuitry.

Career Highlights

Throughout his career, Chiaki Takubo has worked with prominent companies such as Kabushiki Kaisha Toshiba and Toshiba Tec Corporation. His experience in these technological powerhouses has allowed him to refine his skills in semiconductor technology and innovation, culminating in his extensive array of patents.

Collaborations

Chiaki has collaborated with esteemed colleagues in the field, including Hiroshi Tazawa and Hideo Aoki. Together, they have contributed to the development of cutting-edge technologies that enhance semiconductor device functionality and reliability.

Conclusion

Chiaki Takubo's contributions to semiconductor innovation have made a significant impact on the industry. Through his extensive patent work and collaborations, he continues to inspire future advancements in technology, reinforcing his legacy as a leading inventor in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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