The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2012
Filed:
Jul. 31, 2009
Kazumasa Tanida, Kanagawa-ken, JP;
Mie Matsuo, Kanagawa-ken, JP;
Masahiro Sekiguchi, Kanagawa-ken, JP;
Chiaki Takubo, Tokyo, JP;
Kazumasa Tanida, Kanagawa-ken, JP;
Mie Matsuo, Kanagawa-ken, JP;
Masahiro Sekiguchi, Kanagawa-ken, JP;
Chiaki Takubo, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
Semiconductor device includes semiconductor substrate, through hole having first opening and second opening, and including an expansion portion so that an opening area of first opening is greater than an opening area of lowermost portion of expansion portion, first insulating layer, and having an opening which communicates with through hole and has an area smaller than opening area of first opening, first wiring layer provided on first insulating layer, second insulating layer provided on expansion portion of through hole, and to cover first opening and an inner wall surface of through hole, second insulating layer having an opening communicating with opening of first insulating layer so as to expose first wiring layer through opening of first insulating layer, and second wiring layer provided on second insulating layer to extend from inside of through hole, and being connected to first wiring layer via openings of first and second insulating layers.