The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Mar. 01, 2018
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Satoshi Tsukiyama, Kanagawa, JP;
Hideo Aoki, Kanagawa, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 23/31 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 2223/54426 (2013.01);
Abstract
According to one embodiment, a semiconductor device includes a device region covered with a resin film and a dicing region extending along at least one side of the device region, the dicing region including at least a first lithography mark and a second lithography mark. The resin film includes a first dicing region portion which covers a portion of the dicing region between the first lithography mark and the second lithography mark.