The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Feb. 05, 2019
Toshiba Memory Corporation, Tokyo, JP;
Satoshi Tsukiyama, Yokohama Kanagawa, JP;
Hideo Aoki, Yokohama Kanagawa, JP;
Masatoshi Kawato, Kameyama Mie, JP;
Masayuki Miura, Yokkaichi Mie, JP;
Masatoshi Fukuda, Yokkaichi Mie, JP;
Soichi Homma, Yokkaichi Mie, JP;
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Abstract
A semiconductor device includes a first semiconductor chip, a second semiconductor chip thicker than the first semiconductor chip, a plurality of bumps provided between the first and second semiconductor chips and electrically connecting the first and second semiconductor chips, an adhesive resin provided between the first and second semiconductor chips and bonding the first and second semiconductor chips, and a sealing resin encapsulating the first and second semiconductor chips. At least one of the first and second semiconductor chips has an organic protective film disposed thereon.