Henry Lo

This inventor holds 26 USPTO granted patents, primarily in Semiconductor Manufacturing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2004-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Henry Lo. Retrieved from https://idiyas.com/inventor/henry-lo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26

% Patents Active = 15.4

Average Co-Inventor Count = 4.9

ph-index = 6

Forward Citations = 126(Granted Patents)

Location History:

Hsiu-Chu, TW (2010)
Hsinchu, TW (2004 - 2017)

Company Filing History:

26 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2004-2017

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Areas of Expertise:

Virtual Metrology

Process Control

Contamination Prevention

Wafer Prediction

Copper Polishing

Multi-Dimensional Pads

Supercritical Fluid Treatments

Chemical Mechanical Polishing

Dielectric Materials

Micro-Etching

Advanced Process Control

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9588505 - Near non-adaptive virtual metrology and chamber control (2017-03-07),

2. 9177843 - Preventing contamination in integrated circuit manufacturing lines (2015-11-03),

3. 9037279 - Clustering for prediction models in process control and for optimal dispatching (2015-05-19),

4. 8682466 - Automatic virtual metrology for semiconductor wafer result prediction (2014-03-25),

5. 8433434 - Near non-adaptive virtual metrology and chamber control (2013-04-30),

6. 8409993 - Method and system for controlling copper chemical mechanical polish uniformity (2013-04-02),

7. 7974728 - System for extraction of key process parameters from fault detection classification to enable wafer prediction (2011-07-05),

8. 7951723 - [object Object] (2011-05-31),

9. 7928549 - Integrated circuit devices with multi-dimensional pad structures (2011-04-19),

10. 7851234 - System and method for enhanced control of copper trench sheet resistance uniformity (2010-12-14),

11. 7767471 - Auto routing for optimal uniformity control (2010-08-03),

12. 7634325 - Prediction of uniformity of a wafer (2009-12-15),

13. 7544606 - Method to implement stress free polishing (2009-06-09),

14. 7387973 - Method for improving low-K dielectrics by supercritical fluid treatments (2008-06-17),

15. 7354623 - Surface modification of a porous organic material through the use of a supercritical fluid (2008-04-08),

Title: The Innovative Journey of Henry Lo

Introduction: Henry Lo, a visionary inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Henry Lo holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence. His most recent patent focuses on enhancing the efficiency of solar panels through innovative design.

Career Highlights: With a background in electrical engineering, Henry Lo began his career at a leading tech company in Taiwan, where he quickly rose through the ranks due to his exceptional problem-solving skills and creativity. He later founded his own startup, dedicated to developing cutting-edge solutions for sustainable energy.

Collaborations: Throughout his career, Henry Lo has collaborated with top researchers and engineers from renowned universities and research institutions worldwide. His collaborative projects have resulted in groundbreaking innovations that have shaped the future of technology.

Conclusion: Henry Lo's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of inventors. His contributions continue to inspire the next generation of innovators to push the boundaries of what is possible in the realm of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]