The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Jun. 07, 2007
Francis Ko, Taichung, TW;
Chun-hsien Lin, Hsinchu, TW;
Jean Wang, Hsinchu, TW;
Chih-wei Lai, Hsinchu, TW;
Ping-hsu Chen, Hsinchu, TW;
Henry Lo, Hsinchu, TW;
Francis Ko, Taichung, TW;
Chun-Hsien Lin, Hsinchu, TW;
Jean Wang, Hsinchu, TW;
Chih-Wei Lai, Hsinchu, TW;
Ping-Hsu Chen, Hsinchu, TW;
Henry Lo, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A system and method for controlling resistivity uniformity in a Copper trench structure by controlling the CMP process is provided. A preferred embodiment comprises a system and a method in which a plurality of CMP process recipes may be created comprising at least a slurry arm position. A set of metrological data for at least one layer of the semiconductor substrate may be estimated, and an optimum CMP process recipe may be selected based on the set of metrological data. The optimum CMP process recipe may be implemented on the semiconductor substrate.