The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Feb. 05, 2008
Francis Ko, Taichung, TW;
Chih-wei Lai, Hsinchu, TW;
Kewei Zuo, Yonghe, TW;
Henry Lo, Hsinchu, TW;
Jean Wang, Hsin-Chu, TW;
Ping-hsu Chen, Hsinchu, TW;
Chun-hsien Lim, Hsin-Chu, TW;
Chen-hua Yu, Hsin-Chu, TW;
Francis Ko, Taichung, TW;
Chih-Wei Lai, Hsinchu, TW;
Kewei Zuo, Yonghe, TW;
Henry Lo, Hsinchu, TW;
Jean Wang, Hsin-Chu, TW;
Ping-Hsu Chen, Hsinchu, TW;
Chun-Hsien Lim, Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method to enable wafer result prediction includes collecting manufacturing data from various semiconductor manufacturing tools and metrology tools; choosing key parameters using an autokey method based on the manufacturing data; building a virtual metrology based on the key parameters; and predicting wafer results using the virtual metrology.