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Hari S Venugopalan

USPTO Granted Patents = 18 (Patent Applications = 1)

Average Co-Inventor Count = 2.4

ph-index = 13

Forward Citations = 671(Granted Patents)

Company Filing History:

Years Active: 2003-2010

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18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7843074 - Underfill for light emitting device (2010-11-30),

2. 7667236 - Optimized contact design for thermosonic bonding of flip-chip devices (2010-02-23),

3. 7385229 - Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact (2008-06-10),

4. 7358539 - Flip-chip light emitting diode with indium-tin-oxide based reflecting contacts (2008-04-15),

5. 7285801 - LED with series-connected monolithically integrated mesas (2007-10-23),

6. 7190005 - GaN LED with solderable backside metal (2007-03-13),

7. 7179670 - Flip-chip light emitting diode device without sub-mount (2007-02-20),

8. 7141828 - Flip-chip light emitting diode with a thermally stable multiple layer reflective p-type contact (2006-11-28),

9. 7125734 - Increased light extraction from a nitride LED (2006-10-24),

10. 7064356 - Flip chip light emitting diode with micromesas and a conductive mesh (2006-06-20),

11. 7023022 - Microelectronic package having improved light extraction (2006-04-04),

12. 7022550 - Methods for forming aluminum-containing p-contacts for group III-nitride light emitting diodes (2006-04-04),

13. 7015516 - Led packages having improved light extraction (2006-03-21),

14. 6958498 - Optimized contact design for flip-chip LED (2005-10-25),

15. 6903379 - GaN based LED lighting extraction efficiency using digital diffractive phase grating (2005-06-07),

Title: Innovator Spotlight: Hari S. Venugopalan

Introduction

Hari S. Venugopalan is an accomplished inventor based in Somerset, NJ, USA, known for his contributions to the field of light emitting devices. With a remarkable portfolio of 18 patents, he has consistently pushed the boundaries of innovation in semiconductor technology.

Latest Patents

Among his latest patents, one notable invention is the **Underfill for Light Emitting Device**. This invention involves a light emitting chip affixed on a support surface, where bonding bumps create an electrical power input path. The underfill material is strategically positioned to provide mechanical support and enhance thermal conduction without extending beyond the gap between the chip and support surface.

Another significant patent is the **Optimized Contact Design for Thermosonic Bonding of Flip-Chip Devices**. This invention features a semiconductor die with an epitaxial structure creating an active light generating region. It consists of layers with differing conductivity types enabling effective interaction for bonding. The design includes strategically arranged contact traces that facilitate optimal electrical communication and bonding for enhanced performance in light emitting devices.

Career Highlights

Hari has contributed to innovative projects while working with respected companies such as Gelcore, LLC and Lumination LLC. His extensive experience in these organizations has allowed him to develop cutting-edge technologies related to light emitting devices and semiconductor design.

Collaborations

Throughout his career, Hari has had the privilege of collaborating with talented coworkers, including Ivan Eliashevich and Bryan S. Shelton. Their collective expertise and teamwork have played a significant role in the success of various projects and innovations in their field.

Conclusion

With his impressive array of patents and collaborative spirit, Hari S. Venugopalan continues to stand out as a prolific inventor in the semiconductor and light emitting device sectors. His work not only advances technology but also inspires future innovations within the industry.

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