The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Mar. 19, 2003
Hari S. Venugopalan, Somerset, NJ (US);
Hari S. Venugopalan, Somerset, NJ (US);
GELcore, LLC, Valley View, OH (US);
Abstract
A p-type contact () is disclosed for flip chip bonding and electrically contacting a p-type group III-nitride layer () of a group III-nitride flip chip light emitting diode die () with a bonding pad (). A first palladium layer () is disposed on the p-type group III-nitride layer (). The first palladium layer () is diffused through a native oxide of the p-type group III-nitride layer () to make electrical contact with the p-type group III-nitride layer (). A reflective silver layer () is disposed on the first palladium layer (). A second palladium layer () is disposed on the silver layer (). A bonding stack () including at least two layers () is disposed on the second palladium layer (). The bonding stack () is adapted for flip chip bonding the p-type layer () to the bonding pad ().