The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Jun. 22, 2004
Shawn R. Gibb, Charlotte, NC (US);
Robert F. Karlicek, Santa Maria, CA (US);
Prosanto K. Mukerji, Phoenix, AZ (US);
Hari S. Venugopalan, Somerset, NJ (US);
Ivan Eliashevich, Maplewood, NJ (US);
Shawn R. Gibb, Charlotte, NC (US);
Robert F. Karlicek, Santa Maria, CA (US);
Prosanto K. Mukerji, Phoenix, AZ (US);
Hari S. Venugopalan, Somerset, NJ (US);
Ivan Eliashevich, Maplewood, NJ (US);
GELcore, LLC, Valley View, OH (US);
Abstract
A light-emitting element () is disclosed. A light emitting diode (LED) includes a sapphire substrate () having front and back sides (), and a plurality of semiconductor layers () deposited on the front side () of the sapphire substrate (). The semiconductor layers () define a light-emitting structure that emits light responsive to an electrical input. A metallization stack () includes an adhesion layer () deposited on the back side () of the sapphire substrate (), and a solderable layer () connected to the adhesion layer () such that the solderable layer () is secured to the sapphire substrate () by the adhesion layer (). A support structure () is provided on which the LED is disposed. A solder bond () is arranged between the LED and the support structure (). The solder bond () secures the LED to the support structure ().