The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Mar. 05, 2004
Bryan S. Shelton, Bound Brook, NJ (US);
Sebastien Libon, Tervuren, BE;
Hari S. Venugopalan, Somerset, NJ (US);
Ivan Eliashevich, Maplewood, NJ (US);
Stanton E. Weaver, Jr., Northville, NY (US);
Chen-lun Hsing Chen, Taipei, TW;
Thomas F. Soules, Richmond Heights, OH (US);
Steven Leboeuf, Schenectady, NY (US);
Stephen Arthur, Glenville, NY (US);
Bryan S. Shelton, Bound Brook, NJ (US);
Sebastien Libon, Tervuren, BE;
Hari S. Venugopalan, Somerset, NJ (US);
Ivan Eliashevich, Maplewood, NJ (US);
Stanton E. Weaver, Jr., Northville, NY (US);
Chen-Lun Hsing Chen, Taipei, TW;
Thomas F. Soules, Richmond Heights, OH (US);
Steven LeBoeuf, Schenectady, NY (US);
Stephen Arthur, Glenville, NY (US);
GELcore, LLC, Valley View, OH (US);
Abstract
A light emitting diode () has a backside and a front-side with at least one n-type electrode () and at least one p-type electrode () disposed thereon defining a minimum electrodes separation (d). A bonding pad layer () includes at least one n-type bonding pad () and at least one p-type bonding pad () defining a minimum bonding pads separation (d) that is larger than the minimum electrodes separation (d). At least one fanning layer () interposed between the front-side of the light emitting diode () and the bonding pad layer () includes a plurality of electrically conductive paths passing through vias () of a dielectric layer () to provide electrical communication between the at least one n-type electrode () and the at least one n-type bonding pad () and between the at least one p-type electrode () and the at least one p-type bonding pad ().