The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 21, 2006

Filed:

Nov. 14, 2001
Applicants:

Ivan Eliashevich, Maplewood, NJ (US);

Robert F. Karlicek, Jr., Santa Maria, CA (US);

Hari Venugopalan, Somerset, NJ (US);

Inventors:

Ivan Eliashevich, Maplewood, NJ (US);

Robert F. Karlicek, Jr., Santa Maria, CA (US);

Hari Venugopalan, Somerset, NJ (US);

Assignee:

GELcore LLC, Valley View, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light-emitting microelectronic package includes a light-emitting diode () having a first region () of a first conductivity type, a second region () of a second conductivity type, and a light-emitting p-n junction () between the first and second regions. The light-emitting diode defines a lower contact surface () and a mesa () projecting upwardly from the lower contact surface. The first region () of a first conductivity type is disposed in the mesa () and defines a top surface of the mesa, and the second region () of a second conductivity type defines the lower contact surface that substantially surrounds the mesa (). The mesa includes at least one sidewall () extending between the top surface () of the mesa and the lower contact surface (), the at least one sidewall () having a roughened surface for optimizing light extraction from the package.


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