The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2008
Filed:
Apr. 09, 2003
Hari S. Venugopalan, Somerset, NJ (US);
Ivan Eliashevich, Maplewood, NJ (US);
Hari S. Venugopalan, Somerset, NJ (US);
Ivan Eliashevich, Maplewood, NJ (US);
Lumination LLC, Valley View, OH (US);
Abstract
A flip chip light emitting diode die () includes a light-transmissive substrate () and a plurality of semiconductor layers () are disposed on the light-transmissive substrate (). The semiconductor layers () define a light-generating p/n junction. An electrode () is formed on the semiconductor layers () for flip-chip bonding the diode die () to an associated mount (). The electrode () includes an optically transparent layer () formed of a substantially optically transparent material adjacent to the semiconductor layers () that makes ohmic contact therewith, and a reflective layer () adjacent to the optically transparent layer () and in electrically conductive communication therewith.