The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2006
Filed:
Mar. 09, 2005
Michael J. Sackrison, Bethlehem, PA (US);
Hari S. Venugopalan, Somerset, NJ (US);
Xiang Gao, Edison, NJ (US);
Michael J. Sackrison, Bethlehem, PA (US);
Hari S. Venugopalan, Somerset, NJ (US);
Xiang Gao, Edison, NJ (US);
GELcore, LLC, Valley View, OH (US);
Abstract
In a method for fabricating a flip-chip light emitting diode device, a submount wafer is populated with a plurality of the light emitting diode dies. Each device die is flip-chip bonded to the submount. Subsequent to the flip-chip bonding, a growth substrate is removed. The entire submount is immersed in the etchant solution, exposed to the light for a prespecified period of time, removed from the solution, dried and diced into a plurality of LEDs. The LEDs are immediately packaged without any further processing.