The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2006

Filed:

Apr. 07, 2004
Applicant:

Hari S. Venugopalan, Somerset, NJ (US);

Inventor:

Hari S. Venugopalan, Somerset, NJ (US);

Assignee:

GELcore LLC, Valley View, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flip-chip LED device () includes a plurality of group III-nitride semiconductor layers () defining a p/n junction and including a top p-type group III-nitride layer (), and a p-contact () for flip-chip bonding the top p-type group III-nitride layer. The p-contact includes an aluminum layer () disposed on the top p-type group III-nitride layer (), and an interface layer () disposed between the aluminum layer and the top p-type group III-nitride layer. The interface layer reduces a contact resistance between the aluminum layer () and the top p-type group III-nitride layer (). The interface layer comprises one or more group III-nitride layers.


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