logo

For the Inventor, By the Inventor

Guilderland, NY, United States of America

Hari Prasad Amanapu

This inventor holds 18 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignee: International Business Machines Corporation. Active years: 2019-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hari Prasad Amanapu. Retrieved from https://idiyas.com/inventor/hari-prasad-amanapu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 61.1

 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 31(Granted Patents)


Location History:

  • Albuquerque, NM (US) (2021)
  • Guilderland, NY (US) (2019 - 2024)

Company Filing History:

goldMedal18 out of 166,351 
 
International Business Machines Corporation
 patents

Years Active: 2019-2024

Loading Chart...
Loading Chart...
18 patents (USPTO):Explore Patents
1. 11908923 - Low-resistance top contact on VTFET (2024-02-20),
2. 11800817 - Phase change memory cell galvanic corrosion prevention (2023-10-24),
3. 11637036 - Planarization stop region for use with low pattern density interconnects (2023-04-25),
4. 11127825 - Middle-of-line contacts with varying contact area providing reduced contact resistance (2021-09-21),
5. 11037875 - Forming dual metallization interconnect structures in single metallization level (2021-06-15),
6. 11037795 - Planarization of dielectric topography and stopping in dielectric (2021-06-15),
7. 11031337 - Forming dual metallization interconnect structures in single metallization level (2021-06-08),
8. 11024720 - Non-self aligned contact semiconductor devices (2021-06-01),
9. 10978388 - Skip via for metal interconnects (2021-04-13),
10. 10916431 - Robust gate cap for protecting a gate from downstream metallization etch operations (2021-02-09),
11. 10833173 - Low-resistance top contact on VTFET (2020-11-10),
12. 10833122 - Bottom electrode and dielectric structure for MRAM applications (2020-11-10),
13. 10832946 - Recessed interconnet line having a low-oxygen cap for facilitating a robust planarization process and protecting the interconnect line from downstream etch operations (2020-11-10),
14. 10818589 - Metal interconnect structures with self-forming sidewall barrier layer (2020-10-27),
15. 10559530 - Forming dual metallization interconnect structures in single metallization level (2020-02-11),

Title: **Innovative Contributions of Hari Prasad Amanapu in Semiconductor Technologies**

Introduction

Hari Prasad Amanapu, based in Guilderland, NY, is a notable inventor with a significant portfolio of 18 patents. His work primarily focuses on advancing semiconductor technologies, where he has made groundbreaking contributions that enhance the performance and reliability of electronic devices. Currently working at the International Business Machines Corporation (IBM), Amanapu has established himself as a prominent figure in the world of innovation.

Latest Patents

Among his most recent patents, Amanapu has developed a low-resistance top contact on VTFET (Vertical Tunnel Field Effect Transistor). This innovative semiconductor design includes a substrate with a bottom source/drain region and a vertical semiconductor fin designed to improve electrical performance. Another noteworthy patent involves a method for phase change memory cell galvanic corrosion prevention. This process entails the precise deposition and structuring of a metal layer over a wafer, ensuring that critical connection structures are effectively preserved for the formation of a phase change memory stack.

Career Highlights

Amanapu has achieved significant milestones throughout his career. With 18 patents to his name, he has contributed to various aspects of semiconductor design and manufacturing. His work at IBM showcases his dedication to pushing the boundaries of technology and delivering innovative solutions that meet the demanding needs of the electronic industry.

Collaborations

Throughout his career, Amanapu has collaborated with talented individuals, including his coworkers Raghuveer Reddy Patlolla and Cornelius Brown Peethala. These collaborations have undoubtedly played a crucial role in the development of his innovative concepts and patented technologies, enhancing the collaborative spirit within the high-tech environment of IBM.

Conclusion

Hari Prasad Amanapu continues to make significant strides in the field of semiconductor technology. His contributions not only demonstrate his talents as an inventor but also highlight the importance of collaboration in driving innovation forward. As technological advancements continue to shape our world, Amanapu's work remains at the forefront, paving the way for future developments in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…