The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2024

Filed:

Sep. 21, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Christopher J. Waskiewicz, Rexford, NY (US);

Su Chen Fan, Cohoes, NY (US);

Hari Prasad Amanapu, Guilderland, NY (US);

Hemanth Jagannathan, Niskayuna, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8234 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 21/768 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66666 (2013.01); H01L 21/76877 (2013.01); H01L 29/0847 (2013.01); H01L 29/7827 (2013.01);
Abstract

A semiconductor includes a semiconductor substrate having a bottom source/drain region and a vertical semiconductor fin having a bottom end that contacts the semiconductor substrate. The semiconductor device further includes a top source/drain region on a top end of the vertical semiconductor. The top source/drain region is separated from the semiconductor substrate by the vertical semiconductor fin. The semiconductor device further includes an electrically conductive cap on an outer surface of the top source/drain region.


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