The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Oct. 08, 2018
International Business Machines Corporation, Armonk, NY (US);
Hari Prasad Amanapu, Guilderland, NY (US);
Prasad Bhosale, Albany, NY (US);
Nicholas V. LiCausi, Albany, NY (US);
Lars W. Liebmann, Saratoga, NY (US);
James J. McMahon, Clifton Park, NY (US);
Cornelius Brown Peethala, Slingerlands, NY (US);
Michael Rizzolo, Albany, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
Semiconductor devices including skip via structures and methods of forming the skip via structure include interconnection between two interconnect levels that are separated by at least one other interconnect level, i.e., skip via to connect Mx and Mx+2 interconnect levels, wherein the intervening metallization level (MX+1) is electrically isolated from the skip via. Cap layers in the metallization levels are pre-patterned to provide openings therein generally corresponding to locations of the skip via structure prior to high aspect ratio etching to form the skip via structure.