Albany, NY, United States of America

Nicholas V LiCausi


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2021

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: The Innovative Journey of Nicholas V LiCausi

Introduction: Nicholas V LiCausi, an accomplished inventor based in Albany, NY, has made significant contributions to the field of semiconductor technology. With his innovative approach, he has been granted a patent that enhances the performance and efficiency of semiconductor devices.

Latest Patents: Nicholas has developed a notable patent titled "Skip Via for Metal Interconnects." This invention encompasses semiconductor devices that utilize skip via structures, allowing for interconnection between two interconnect levels that are separated by at least one other interconnect level. The skip via connects levels Mx and Mx+2 while keeping the intervening metallization level electrically isolated. His method includes pre-patterning cap layers in the metallization levels to create openings corresponding to the locations of the skip via structures before high aspect ratio etching, which effectively forms the skip via structure.

Career Highlights: Nicholas currently works at the prestigious International Business Machines Corporation (IBM), where he applies his expertise in semiconductor technology and innovation. His educational background, coupled with practical experience at IBM, has allowed him to develop pioneering solutions in the semiconductor field.

Collaborations: Throughout his career, Nicholas has collaborated with talented engineers and inventors, including his colleagues Hari Prasad Amanapu and Prasad Bhosale. Together, they have contributed to the advancement of semiconductor technologies and have worked on projects that aim to improve the functionality and reliability of electronic devices.

Conclusion: Nicholas V LiCausi is a prominent figure in the world of semiconductor innovation. His patented invention, "Skip Via for Metal Interconnects," is a testament to his skill and forward-thinking approach. As he continues to work with IBM and collaborate with other industry professionals, Nicholas's contributions to technology will undoubtedly have a lasting impact on the field.

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