International Business Machines Corporation

Nicholas V LiCausi

Lars W Liebmann

Michael Rizzolo

Cornelius Brown Peethala

Hari Prasad Amanapu

Prasad Bhosale

James Jay McMahon

Semiconductor devices including skip via structures and methods of forming the skip via structure include interconnection between two interconnect levels that are separated by at least one other interconnect level, i.e., skip via to connect Mx and Mx+2 interconnect levels, wherein the intervening metallization level (MX+1) is electrically isolated from the skip via. Cap layers in the metallization levels are pre-patterned to provide openings therein generally corresponding to locations of the skip via structure prior to high aspect ratio etching to form the skip via structure.

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Nicholas V LiCausi