Company Filing History:

86 out of 203

Pdf Solutions, Incorporated

patents

1 out of 2

Applied Integrated Systems & Software

patents

Years Active: 2004-2021

where 'Filed Patents' based on already Granted Patents

87 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),

2. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),

3. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),

4. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),

5. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),

6. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),

7. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),

8. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),

9. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),

10. 10380305 - Direct probing characterization vehicle for transistor, capacitor and resistor testing (2019-08-13),

11. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),

12. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),

13. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),

14. 10211111 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas (2019-02-19),

15. 10199294 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-02-05),

Certainly! Here is the requested article:

Title: The Innovator Extraordinaire: Unveiling the Legacy of Hans Eisenmann

Introduction: Hans Eisenmann, a visionary inventor hailing from Tutzing, Germany, has left an indelible mark on the realm of innovation with his trailblazing spirit and groundbreaking creations. With a staggering number of 87 patents to his name, Hans Eisenmann stands tall as a luminary in the global landscape of inventions and patents.

Latest Patents: Among his latest patents is an IC with test structures and e-beam pads embedded within a contiguous standard cell area. This innovative IC features a 4x3 e-beam pad seamlessly integrated into a standard cell area, catering to advanced manufacturing processes with an accompanying e-beam testable structure.

Career Highlights: Hans Eisenmann's illustrious career has seen him contribute significantly to renowned companies such as PDF Solutions, Incorporated, and Applied Integrated Systems & Software. His expertise and ingenuity have played a pivotal role in driving forward technological advancements in the industry.

Collaborations: Alongside his remarkable solo achievements, Hans Eisenmann has collaborated with esteemed professionals in the field, including Dennis Ciplickas and Christopher Hess. Together, they have forged formidable partnerships, leading to the development of cutting-edge solutions and transformative innovations.

Conclusion: In conclusion, Hans Eisenmann's relentless pursuit of innovation and his passion for creating solutions to complex challenges have solidified his reputation as a prominent inventor in the global landscape of inventions and patents. His invaluable contributions continue to inspire generations of inventors, setting a high standard for excellence and creativity in the ever-evolving world of technology.

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