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For the Inventor, By the Inventor

Hsinchu, Taiwan

Fu-Chiang Kuo

USPTO Granted Patents = 17 

Average Co-Inventor Count = 1.6

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:

goldMedal17 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2017-2025

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17 patents (USPTO):
1. 12444688 - Deep trench protection (2025-10-14),
2. 12431444 - Package structure having trench capacitor (2025-09-30),
3. 12424538 - Semiconductor device including dummy deep trench capacitors and a method of manufacturing thereof (2025-09-23),
4. 12408357 - Capacitance structure (2025-09-02),
5. 12356636 - Deep trench capacitor structure and method for forming the same (2025-07-08),
6. 12328881 - Deformation-resistant deep trench capacitor structure and methods of forming the same (2025-06-10),
7. 12294033 - Deep trench capacitor array with reduced warpage (2025-05-06),
8. 12119414 - Semiconductor trench capacitor structure and manufacturing method thereof (2024-10-15),
9. 12113099 - Deep trench capacitor including stress-relief voids and methods of forming the same (2024-10-08),
10. 12015050 - Deep trench capacitor including stress-relief voids and methods of forming the same (2024-06-18),
11. 11855129 - Capacitance structure (2023-12-26),
12. 11817510 - Semiconductor trench capacitor structure and manufacturing method thereof (2023-11-14),
13. 11373952 - Deep trench protection (2022-06-28),
14. 10804206 - Deep trench protection (2020-10-13),
15. 10424549 - Trench structure and method (2019-09-24),

Title: Fu-Chiang Kuo: Innovator in Semiconductor Technology

Introduction

Fu-Chiang Kuo is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His innovative work has advanced the design and functionality of semiconductor devices, making him a key figure in the industry.

Latest Patents

Among his latest patents, Kuo has developed a semiconductor device featuring deep trench protection. This device includes at least one conductive feature on a substrate, a dielectric layer overlying the substrate, and a trench structure extending through the dielectric layer, topped with a protection layer. Another notable patent is a package structure that incorporates trench capacitors. This semiconductor structure consists of a substrate with first and second trenches arranged in specific directions, each containing capacitor segments with varying lengths.

Career Highlights

Fu-Chiang Kuo is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has not only contributed to the company's success but has also set new standards in semiconductor design and manufacturing.

Collaborations

Kuo has collaborated with several talented individuals in his field, including Shih-Chi Kuo and Tsung-Hsien Lee. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in semiconductor applications.

Conclusion

Fu-Chiang Kuo's contributions to semiconductor technology through his numerous patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the future of semiconductor design and functionality.

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