Tainan, Taiwan

Fei-Gwo Tsai


Average Co-Inventor Count = 3.0

ph-index = 4

Forward Citations = 152(Granted Patents)


Location History:

  • Hsin-Chu, TW (2002 - 2011)
  • Tainan, TW (2006 - 2014)
  • Taipei, TW (2015 - 2024)

Company Filing History:


Years Active: 2002-2024

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30 patents (USPTO):

Title: Fei-Gwo Tsai: Innovator in Substrate Support Apparatus and Semiconductor Fabrication

Introduction

Fei-Gwo Tsai, a prominent inventor based in Tainan, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 30 patents, Tsai continues to innovate solutions that enhance semiconductor manufacturing processes.

Latest Patents

Among his latest innovations are two noteworthy patents. The first is a “Substrate Support Apparatus and Method,” which features a housing with multiple spherical supports. This apparatus is designed to position the supports in a specific manner, ensuring that the topmost surfaces of the supports align in a precise plane above the housing’s top surface. Additionally, each spherical support can rotate within the housing, providing enhanced functionality for semiconductor applications.

The second patent, titled “Method of Fabricating Reticle,” describes a process that involves receiving both a device design layout and a surrounding scribe line design layout. Tsai’s method requires the rotation of these layouts in different directions, followed by an optical proximity correction (OPC) process to ensure high precision. The outcome is a reticle that incorporates both design layouts, optimized for semiconductor manufacturing.

Career Highlights

Fei-Gwo Tsai has established a reputable career at Taiwan Semiconductor Manufacturing Company Ltd., where his work on innovative technologies continues to propel advancements in the industry. His expertise has been pivotal in optimizing semiconductor production processes, ultimately contributing to larger efficiencies in technology development.

Collaborations

Throughout his career, Tsai has collaborated with esteemed colleagues, including Jui-Ping Chuang and Li-Kong Turn. These partnerships have fostered a collaborative environment for innovation, allowing for multifaceted approaches to addressing challenges in semiconductor design and fabrication.

Conclusion

In summary, Fei-Gwo Tsai stands out as a key figure in the semiconductor field, with a remarkable track record of patents and collaborative endeavors that drive innovation. His contributions to substrate support apparatus and reticle fabrication exemplify his commitment to advancing technology and improving manufacturing processes.

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