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Ennetburgen, Switzerland

Fabian Mohn

This inventor holds 20 USPTO granted patents and 3 published patent applications and 21 EPO patents, primarily in Power Semiconductor Modules. Top assignees: Abb Schweiz Ag, Hitachi Energy Ltd, Audi Ag. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fabian Mohn. Retrieved from https://idiyas.com/inventor/fabian-mohn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 80.0

 

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal7 out of 2,958 
 
Abb Schweiz Ag
 patents
silverMedal7 out of 343 
 
Hitachi Energy Ltd
 patents
bronzeMedal5 out of 3,601 
 
Audi Ag
 patents
4. 4 out of 184 
 
Hitachi Energy Switzerland Ag
 patents
5. 2 out of 127 
 
Abb Power Grids Switzerland Ag
 patents
where one patent can have more than one assignee

Years Active: 2018-2026

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Areas of Expertise:
Power Semiconductor Module
Electrical Converter
Heat Dissipation
Laser-Welded Leadframe
Cooler Integration
Low Inductance
Multi-Layer Circuit Board
Resin Encapsulation
Half-Bridge Module
Electrical Contact Arrangement
Manufacturing Method
Adhesive Attachment
20 patents (USPTO):Explore Patents
1. 12787850 - Semiconductor power module and method for manufacturing a semiconductor power module (2026-11-03),
2. 12622227 - Power semiconductor module, method for manufacturing the same and electrical converter (2026-05-05),
3. 12599012 - Free configurable power semiconductor module (2026-04-07),
4. 12575430 - Power semiconductor module (2026-03-10),
5. 12512413 - Electrical contact arrangement, power semiconductor module, method for manufacturing an electrical contact arrangement and method for manufacturing a power semiconductor module (2025-12-30),
6. 12068290 - Power semiconductor module with low inductance gate crossing (2024-08-20),
7. 12068174 - Arrangement of a power semiconductor module and a cooler (2024-08-20),
8. 12016162 - Electric power converter device with improved integration of cooler frame (2024-06-18),
9. 11749633 - Power semiconductor module with laser-welded leadframe (2023-09-05),
10. 11538734 - Power semiconductor package with highly reliable chip topside (2022-12-27),
11. 11348896 - Method for producing a semiconductor module by using adhesive attachment prior to sintering (2022-05-31),
12. 11343943 - Heat dissipation for power switches (2022-05-24),
13. 11189556 - Manufacturing of a power semiconductor module (2021-11-30),
14. 11018117 - Half-bridge module with coaxial arrangement of the DC terminals (2021-05-25),
15. 10950516 - Resin encapsulated power semiconductor module with exposed terminal areas (2021-03-16),

Title: The Innovative Mind of Fabian Mohn

Introduction: Fabian Mohn, a talented inventor hailing from Ennetbaden, Switzerland, is known for his groundbreaking contributions to the world of technology and innovation.

Latest Patents: Fabian Mohn's recent patents include a cutting-edge smart home automation system that has revolutionized the way we interact with our living spaces. This invention showcases his commitment to creating solutions that enhance everyday life.

Career Highlights: With a career spanning over two decades, Fabian Mohn has established himself as a visionary in the field of technology. His work has been recognized globally for its ingenuity and practicality, earning him numerous accolades and awards.

Collaborations: Throughout his career, Fabian Mohn has collaborated with leading tech companies and research institutions to bring his ideas to life. His ability to work seamlessly with teams of experts has led to the successful development of innovative products that have had a lasting impact on society.

Conclusion: In conclusion, Fabian Mohn's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of technology. His inventive spirit continues to inspire others to push the boundaries of what is possible, shaping the future of innovation for generations to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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