The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2022
Filed:
Apr. 09, 2020
Applicants:
Audi Ag, Ingolstadt, DE;
Hitachi Energy Switzerland Ag, Baden, CH;
Inventors:
Assignees:
AUDI AG, Ingolstadt, DE;
Hitachi Energy Switzerland AG, Baden, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B60R 16/033 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B60R 16/033 (2013.01); H01L 24/30 (2013.01); H02M 7/003 (2013.01); H01L 2224/8384 (2013.01);
Abstract
A method for producing a semiconductor module, involving the steps: providing a carrier plate and a substrate having a bonding layer arranged on a surface of the carrier plate or the substrate, applying adhesive in multiple adhesive areas of the carrier plate or the substrate which are free from the bonding layer, positioning the substrate on the carrier plate such that the substrate and the carrier plate are in contact with the bonding layer and the adhesive, and joining the substrate and the carrier plate across the bonding layer by melting or sintering of the bonding layer.