Oberrohrdorf, Switzerland

Chunlei Liu

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Oberrohdorf, CH (2021)
  • Oberrohrdorf, CH (2020 - 2022)

Company Filing History:


Years Active: 2020-2022

where 'Filed Patents' based on already Granted Patents

6 patents (USPTO):

Title: The Innovative Contributions of Chunlei Liu

Introduction

Chunlei Liu is a prominent inventor based in Oberrohrdorf, Switzerland. He has made significant contributions to the field of power semiconductor technology, holding a total of six patents. His work focuses on enhancing the reliability and efficiency of semiconductor modules.

Latest Patents

One of Liu's latest patents is a power semiconductor package with highly reliable chip topside. This innovative module includes a substrate with a metallization layer and a power semiconductor chip bonded to it. A metallic plate is bonded to the chip, designed to optimize the distribution of metal material, enhancing the module's performance. Another notable patent is a method for producing a semiconductor module using adhesive attachment prior to sintering. This method involves a series of steps that ensure a strong bond between the substrate and the carrier plate, improving the overall manufacturing process.

Career Highlights

Chunlei Liu has worked with leading companies in the industry, including ABB Power Grids Switzerland AG and Hitachi Energy Switzerland AG. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Liu has collaborated with notable colleagues such as Fabian Mohn and Franc Dugal, contributing to various projects that advance semiconductor technology.

Conclusion

Chunlei Liu's contributions to the field of power semiconductors are noteworthy, with several patents that reflect his innovative spirit and technical expertise. His work continues to influence the industry and pave the way for future advancements.

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