The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
May. 22, 2019
Applicants:
Abb Schweiz Ag, Baden, CH;
Audi Ag, Ingolstadt, DE;
Inventors:
Assignees:
ABB Power Grids Switzerland AG, Baden, CH;
AUDI AG, Ingolstadt, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49861 (2013.01); H01L 21/4839 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49838 (2013.01); H01L 23/49555 (2013.01); H01L 23/49844 (2013.01);
Abstract
A semi-manufactured power semiconductor module includes a substrate for bonding at least one power semiconductor chip; a first leadframe bonded to the substrate and providing power terminals; and a second leadframe bonded to the substrate and providing auxiliary terminals; wherein the first leadframe and/or the second leadframe include an interlocking element adapted for aligning the first leadframe and the second leadframe with respect to each other and/or with respect to a mold for molding an encapsulation around the substrate, the first leadframe and the second leadframe.