The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2025
Filed:
Feb. 25, 2021
Applicant:
Hitachi Energy Ltd, Zürich, CH;
Inventors:
Slavo Kicin, Zürich, CH;
Chunlei Liu, Oberrohrdorf, CH;
Andrey Petrov, Zürich, CH;
Gernot Riedel, Baden-Rütihof, CH;
Assignee:
Hitachi Energy Ltd, Zurich, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/50 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/50 (2013.01); H01L 23/3735 (2013.01); H01L 23/49562 (2013.01);
Abstract
In one embodiment, a power module device includes a base plate, an electrically insulating ceramic layer on the base plate, and an electrically insulating first insulating layer on the ceramic layer. The first insulating layer includes a prepreg material. An electrically conductive lead frame is disposed on the first insulating layer and electrically insulated therefrom. A power semiconductor device disposed on the lead frame and embedded between the lead frame and a second insulating layer.