The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
Mar. 10, 2022
Hitachi Energy Ltd, Zürich, CH;
David Guillon, Vorderthal, CH;
Fabian Mohn, Ennetbaden, CH;
HITACHI ENERGY LTD, Zürich, CH;
Abstract
A semiconductor power module for a semiconductor device comprises a leadframe or substrate and a resin body that is coupled to the leadframe or substrate. The resin body includes at least a first resin element and a second resin element, wherein a resin material of the first resin element is different from a resin material of the second resin element. The resin elements are configured such that they are separated in part at least with respect to surface areas facing each other by means of a recess.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile