Dong Niu

This inventor holds 14 USPTO granted patents and 2 published patent applications, primarily in Thin Film Deposition. Top assignees: Novellus Systems Incorporated, Lam Research Corporation. Active years: 2006-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong Niu. Retrieved from https://idiyas.com/inventor/dong-niu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 14 (Patent Applications = 2)

% Patents Active = 85.7

Average Co-Inventor Count = 4.6

ph-index = 7

Forward Citations = 220(Granted Patents)

Location History:

Tualatin, OR (US) (2006 - 2010)
West Linn, OR (US) (2014 - 2023)

Company Filing History:

13 out of 993

Novellus Systems Incorporated

patents

1 out of 3,955

Lam Research Corporation

patents

Years Active: 2006-2025

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Areas of Expertise:

Plasma-Enhanced Deposition

Wafer Placement Correction

PECVD Apparatus

Film Stacks

Soft Annealing

Doped Amorphous Silicon

Low-k Dielectric Materials

Cracking Resistance

Integration Performance

Silicon-Containing Films

Carbon Doped Oxide Films

Residual Stress

14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12385138 - Plasma-enhanced deposition of film stacks (2025-08-12),

2. 12217985 - Wafer placement correction in indexed multi-station processing chambers (2025-02-04),

3. 11746420 - PECVD apparatus for in-situ deposition of film stacks (2023-09-05),

4. 10214816 - PECVD apparatus for in-situ deposition of film stacks (2019-02-26),

5. 9165788 - Post-deposition soft annealing (2015-10-20),

6. 9028924 - In-situ deposition of film stacks (2015-05-12),

7. 8895415 - Tensile stressed doped amorphous silicon (2014-11-25),

8. 8741394 - In-situ deposition of film stacks (2014-06-03),

9. 8709551 - Smooth silicon-containing films (2014-04-29),

10. 7781351 - Methods for producing low-k carbon doped oxide films with low residual stress (2010-08-24),

11. 7390537 - Methods for producing low-k CDO films with low residual stress (2008-06-24),

12. 7381662 - Methods for improving the cracking resistance of low-k dielectric materials (2008-06-03),

13. 7326444 - Methods for improving integration performance of low stress CDO films (2008-02-05),

14. 7094713 - Methods for improving the cracking resistance of low-k dielectric materials (2006-08-22),

Title: The Innovative Journey of Dong Niu

Introduction: Dong Niu, a talented inventor hailing from West Linn, Oregon, has made significant contributions to the world of innovations with his creative mind and dedication to progress.

Latest Patents: Dong Niu's latest patents showcase his commitment to pushing boundaries in various industries, including technology, healthcare, and sustainability. His recent inventions have been recognized for their ingenuity and practicality.

Career Highlights: Throughout his illustrious career, Dong Niu has been at the forefront of groundbreaking inventions that have revolutionized the way we live and work. His passion for innovation has led to the development of cutting-edge solutions that address complex challenges.

Collaborations: Dong Niu has collaborated with leading experts in the field to bring his ideas to life. His partnerships with top researchers, engineers, and designers have resulted in successful projects that have garnered international acclaim.

Conclusion: Dong Niu's relentless pursuit of innovation and his unwavering commitment to excellence continue to inspire the next generation of inventors. His impact on the world of inventions is truly remarkable, and his legacy will undoubtedly endure for years to come.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: