The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Dec. 16, 2010
Jason Haverkamp, Clifton Park, NY (US);
Pramod Subramonium, Beaverton, OR (US);
Joe Womack, Tigard, OR (US);
Dong Niu, West Linn, OR (US);
Keith Fox, Tigard, OR (US);
John Alexy, West Linn, OR (US);
Patrick Breiling, Portland, OR (US);
Jennifer O'loughlin, Portland, OR (US);
Mandyam Sriram, Beaverton, OR (US);
George Andrew Antonelli, Portland, OR (US);
Bart Van Schravendijk, Sunnyvale, CA (US);
Jason Haverkamp, Clifton Park, NY (US);
Pramod Subramonium, Beaverton, OR (US);
Joe Womack, Tigard, OR (US);
Dong Niu, West Linn, OR (US);
Keith Fox, Tigard, OR (US);
John Alexy, West Linn, OR (US);
Patrick Breiling, Portland, OR (US);
Jennifer O'Loughlin, Portland, OR (US);
Mandyam Sriram, Beaverton, OR (US);
George Andrew Antonelli, Portland, OR (US);
Bart van Schravendijk, Sunnyvale, CA (US);
Novellus Systems, Inc., Fremont, CA (US);
Abstract
Methods for depositing film stacks by plasma enhanced chemical vapor deposition are described. In one example, a method for depositing a film stack on a substrate, wherein the film stack includes films of different compositions and the deposition is performed in a process station in-situ, is provided. The method includes, in a first plasma-activated film deposition phase, depositing a first layer of film having a first film composition on the substrate; in a second plasma-activated deposition phase, depositing a second layer of film having a second film composition on the first layer of film; and sustaining the plasma while transitioning a composition of the plasma from the first plasma-activated film deposition phase to the second plasma-activated film deposition phase.