David F Abdo

This inventor holds 18 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc.. Active years: 2008-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David F Abdo. Retrieved from https://idiyas.com/inventor/david-f-abdo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18

% Patents Active = 94.4

Average Co-Inventor Count = 3.2

ph-index = 6

Forward Citations = 95(Granted Patents)

Location History:

Tempe, AZ (US) (2018)
Scottsdale, AZ (US) (2008 - 2022)

Company Filing History:

Freescale Semiconductor,inc.

patents

Years Active: 2008-2022

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Areas of Expertise:

Semiconductor Packaging

Heat Dissipation

Wafer Dicing

RF Amplifier

Encapsulated Devices

Mechanical Lock Features

Optical Inspection

Gallium Nitride

Die Attachment

Microelectronic Components

Isolation Structure

Air Cavity Packages

18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11437276 - Packaged dies with metal outer layers extending from die back sides toward die front sides (2022-09-06),

2. 10861764 - Microelectronic components having integrated heat dissipation posts and systems including the same (2020-12-08),

3. 10741446 - Method of wafer dicing for wafers with backside metallization and packaged dies (2020-08-11),

4. 10637400 - RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof (2020-04-28),

5. 10630246 - Methods of manufacturing encapsulated semiconductor device package with heatsink opening (2020-04-21),

6. 10269678 - Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof (2019-04-23),

7. 10109594 - Semiconductor device with an isolation structure coupled to a cover of the semiconductor device (2018-10-23),

8. 10075132 - RF amplifier with conductor-less region underlying filter circuit inductor, and methods of manufacture thereof (2018-09-11),

9. 9922894 - Air cavity packages and methods for the production thereof (2018-03-20),

10. 9893027 - Pre-plated substrate for die attachment (2018-02-13),

11. 9787254 - Encapsulated semiconductor device package with heatsink opening, and methods of manufacture thereof (2017-10-10),

12. 9425161 - Semiconductor device with mechanical lock features between a semiconductor die and a substrate (2016-08-23),

13. 9349693 - Semiconductor device with an isolation structure coupled to a cover of the semiconductor device (2016-05-24),

14. 9111984 - Devices and methods of operation for separating semiconductor die from adhesive tape (2015-08-18),

15. 9099567 - Packaged semiconductor devices and methods of their fabrication (2015-08-04),

Title: The Inventor David F Abdo: Pioneering Innovations in Tempe

Introduction: David F Abdo is a distinguished inventor based in Tempe, Arizona, known for his groundbreaking contributions to various fields through his innovative creations.

Latest Patents: David F Abdo holds several patents in the areas of technology, healthcare, and sustainable energy, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, David F Abdo has consistently pushed the boundaries of traditional thinking, leading to the development of cutting-edge solutions that have revolutionized industries.

Collaborations: Throughout his career, David F Abdo has collaborated with leading researchers, engineers, and scientists, fostering a culture of innovation and knowledge-sharing that has resulted in numerous successful projects.

Conclusion: David F Abdo's passion for innovation, coupled with his relentless drive to create a positive impact on society, solidifies his position as a visionary inventor whose work continues to inspire future generations.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]