The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Oct. 28, 2013
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Audel A. Sanchez, Tempe, AZ (US);

David F. Abdo, Scottsdale, AZ (US);

Michael L. Eleff, Phoenix, AZ (US);

Assignee:

FREESCALE SEMICONDUCTOR INC., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/67132 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1944 (2015.01);
Abstract

The embodiments described herein provide an apparatus and method for separating dies from adhesive tape. In general, these techniques use applied vacuum and one or more channels in an extractor base surface to progressively peel adhesive tape away from the die. When the adhesive tape has been peeled away from the entire die the die can be removed and packaged. Such a technique can reduce the strain the die and thus may reduce the probability of cracks occurring in the die, and is thus particularly applicable to removing adhesive tape from relatively thin dies.


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