Audel Sanchez

This inventor holds 28 USPTO granted patents, primarily in Microelectronic Packaging. Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc.. Active years: 2006-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Audel Sanchez. Retrieved from https://idiyas.com/inventor/audel-sanchez

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28

% Patents Active = 89.3

Average Co-Inventor Count = 3.8

ph-index = 6

Forward Citations = 86(Granted Patents)

Company Filing History:

Freescale Semiconductor,inc.

patents

Years Active: 2006-2024

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Areas of Expertise:

Microelectronic Packages

Molded Air Cavity

Die Bonding

Top Terminations

Semiconductor Devices

Radio Frequency

Integrated Circuits

Manufacturing Methods

Leadless Packages

Die Crack Detector

Bonding Techniques

Fabrication Methods

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12087671 - Overmolded microelectronic packages containing knurled flanges and methods for the production thereof (2024-09-10),

2. 11343919 - Packaged electronic devices with top terminations (2022-05-24),

3. 10998255 - Overmolded microelectronic packages containing knurled flanges and methods for the production thereof (2021-05-04),

4. 10861774 - Internally-shielded microelectronic packages and methods for the fabrication thereof (2020-12-08),

5. 10629518 - Internally-shielded microelectronic packages and methods for the fabrication thereof (2020-04-21),

6. 10529638 - Molded air cavity packages and methods for the production thereof (2020-01-07),

7. 10396006 - Molded air cavity packages and methods for the production thereof (2019-08-27),

8. 10375833 - Methods of manufacturing packaged electronic devices with top terminations (2019-08-06),

9. 10241151 - Die crack detector and method therefor (2019-03-26),

10. 10199303 - Molded air cavity packages and methods for the production thereof (2019-02-05),

11. 10199302 - Molded air cavity packages and methods for the production thereof (2019-02-05),

12. 10141227 - Method and system for achieving semiconductor-based circuits or systems having multiple components with one or more matched or similar characteristics or features (2018-11-27),

13. 9986646 - Packaged electronic devices with top terminations, and methods of manufacture thereof (2018-05-29),

14. 9800208 - Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof (2017-10-24),

15. 9646897 - Die crack detector with integrated one-time programmable element (2017-05-09),

Title: Audel Sanchez: Pioneering Inventor from Tempe

Introduction: Audel Sanchez is a distinguished inventor based in Tempe, Arizona, known for his groundbreaking contributions to various industries.

Latest Patents: Audel Sanchez holds several patents in the fields of renewable energy, sustainable technology, and consumer electronics, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: Throughout his career, Audel Sanchez has been recognized for his ability to transform ideas into tangible inventions that have a positive impact on society. His dedication to pushing the boundaries of technology has led to the development of cutting-edge solutions.

Collaborations: Audel Sanchez has collaborated with leading research institutions, universities, and companies to further enhance his inventions and bring them to the market. His collaborative spirit has been instrumental in the success of many projects.

Conclusion: Audel Sanchez's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazer in the world of inventions. His work continues to inspire the next generation of inventors and shape the future of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]