The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Oct. 28, 2013
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Audel A. Sanchez, Tempe, AZ (US);

Michele L. Miera, Gilbert, AZ (US);

Robert A. Pryor, Mesa, AZ (US);

Jose L. Suarez, Chandler, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/58 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 22/34 (2013.01); H01L 23/585 (2013.01); H01L 22/14 (2013.01); H01L 23/5256 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3512 (2013.01);
Abstract

The embodiments described herein provide a die crack detector and method that use a conductive trace arranged to at least substantially extend around a perimeter of an integrated circuit die. A one-time programmable element, such as a fuse, is coupled in series with the conductive trace, and a package lead is electrically coupled to both the fuse and another operational element on the integrated circuit die. With the fuse intact the package lead can thus be used to determine a measurement of the conductivity of the conductive trace, with the measurement of conductivity indicative of the presence of a crack on the die. After such testing the fuse can be electrically opened, and the package lead used for normal operation of the device on the packaged die without the conductive trace interfering with this operation.


Find Patent Forward Citations

Loading…