IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9800208 B1

PDFFull Text
Date of Patent:
Oct. 24, 2017

Filed:

Feb. 16, 2016

Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Mahesh K. Shah, Scottsdale, AZ (US);

Jerry L. White, Glendale, AZ (US);

Li Li, Scottsdale, AZ (US);

Hussain H. Ladhani, Chandler, AZ (US);

Audel A. Sanchez, Tempe, AZ (US);

Lakshminarayan Viswanathan, Phoenix, AZ (US);

Fernando A. Santos, Chandler, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:

Steven J Mottola

Int. Cl.
CPC ...
H03F 1/00 (2006.01); H03F 1/02 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01); H03F 1/56 (2006.01); H03F 3/21 (2006.01); H03F 1/30 (2006.01); H03H 1/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/66 (2006.01); H03F 3/193 (2006.01); H05K 7/00 (2006.01); H01L 23/64 (2006.01); H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0288 (2013.01); H01L 23/3107 (2013.01); H01L 23/49562 (2013.01); H01L 23/642 (2013.01); H01L 23/66 (2013.01); H03F 1/0283 (2013.01); H03F 1/30 (2013.01); H03F 1/565 (2013.01); H03F 3/193 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/213 (2013.01); H03H 1/00 (2013.01); H05K 7/005 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6666 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/0002 (2013.01); H03F 2200/267 (2013.01); H03F 2200/451 (2013.01); H03F 2200/555 (2013.01); H03F 2203/21103 (2013.01); H03F 2203/21106 (2013.01); H03F 2203/21139 (2013.01); H03H 7/38 (2013.01); H03H 2001/0021 (2013.01);
Abstract

An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

Find Patent Forward Citations

Loading…