logo

For the Inventor, By the Inventor

Scottsdale, AZ, United States of America

Mahesh K Shah

This inventor holds 24 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc., Motorola Corporation. Active years: 1996-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mahesh K Shah. Retrieved from https://idiyas.com/inventor/mahesh-k-shah

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24

% Patents Active = 83.3

Average Co-Inventor Count = 3.3

ph-index = 8

Forward Citations = 206(Granted Patents)


Company Filing History:

goldMedal13 out of 2,851 
 
Nxp USA, Inc.
 patents
silverMedal7 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
bronzeMedal4 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1996-2020

Loading Chart...
Areas of Expertise:
Microelectronic Components
Heat Dissipation
Sinter Attachment
Electromagnetic Coupling
Isolation Wall
Thermal Extension Levels
High Power Subsystems
Surface-Mountable Capacitors
Impedance Matching
Solder Wettable Flanges
Chemical Die Singulation
Sensing Transducer
24 patents (USPTO):Explore Patents
1. 10861764 - Microelectronic components having integrated heat dissipation posts and systems including the same (2020-12-08),
2. 10806021 - Packaged microelectronic component mounting using sinter attachment (2020-10-13),
3. 10630243 - Semiconductor package having an isolation wall to reduce electromagnetic coupling (2020-04-21),
4. 10476442 - Semiconductor package having an isolation wall to reduce electromagnetic coupling (2019-11-12),
5. 10440813 - Microelectronic modules including thermal extension levels and methods for the fabrication thereof (2019-10-08),
6. 10405417 - Packaged microelectronic component mounting using sinter attachment (2019-09-03),
7. 10269678 - Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof (2019-04-23),
8. 10211177 - High power semiconductor package subsystems (2019-02-19),
9. 10110170 - Semiconductor package having an isolation wall to reduce electromagnetic coupling (2018-10-23),
10. 9800208 - Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof (2017-10-24),
11. 9673162 - High power semiconductor package subsystems (2017-06-06),
12. 9607953 - Semiconductor package with isolation wall (2017-03-28),
13. 9538659 - Solder wettable flanges and devices and systems incorporating solder wettable flanges (2017-01-03),
14. 9484222 - Semiconductor devices, semiconductor device packages, and packaging techniques for impedance matching and/or low frequency terminations (2016-11-01),
15. 9450547 - Semiconductor package having an isolation wall to reduce electromagnetic coupling (2016-09-20),

Title: Mahesh K Shah: Innovator in Microelectronic Systems

Introduction

Mahesh K Shah, located in Scottsdale, AZ, is a prolific inventor known for his contributions to the field of microelectronics. With a remarkable portfolio consisting of 24 patents, he has made significant strides in developing innovative solutions in microelectronic components and systems.

Latest Patents

Among his latest patents, Mahesh has developed technologies such as "Microelectronic components having integrated heat dissipation posts and systems including the same." This invention introduces microelectronic systems featuring a substrate with a unique design, where a heat dissipation post projects from the component and is precisely positioned within a socket cavity. His other patent, "Packaged microelectronic component mounting using sinter attachment," describes an advanced method of attaching packaged microelectronic components to secondary structures. This involves a low-temperature sintering process to form a robust bond layer, ensuring enhanced performance in applications like printed circuit boards and heat sinks.

Career Highlights

Mahesh has had an impressive career, having worked with several notable companies, including NXP USA, Inc. and Freescale Semiconductor, Inc. His work has impacted the microelectronics industry, leading to advancements that improve the functionality and efficiency of electronic devices.

Collaborations

Throughout his career, Mahesh has collaborated with talented professionals, including his coworkers Lakshminarayan Viswanathan and Lu Li. These partnerships have fostered a creative environment that encourages innovation and the pursuit of cutting-edge technologies in microelectronics.

Conclusion

Mahesh K Shah's contributions to microelectronic systems are a testament to his ingenuity and dedication to advancing technology. With numerous patents under his belt, he continues to shape the industry and inspire future innovations in microelectronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…