The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2019
Filed:
Dec. 05, 2017
Nxp Usa, Inc., Austin, TX (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Mahesh K. Shah, Scottsdale, AZ (US);
Lu Li, Gilbert, AZ (US);
David Abdo, Scottsdale, AZ (US);
Geoffrey Tucker, Tempe, AZ (US);
Carl Emil D'Acosta, Mesa, AZ (US);
Jaynal A. Molla, Gilbert, AZ (US);
Justin Eugene Poarch, Gilbert, AZ (US);
Paul Hart, Phoenix, AZ (US);
NXP USA, Inc., Austin, TX (US);
Abstract
Microelectronic systems having integrated heat dissipation posts are disclosed, as are methods for fabricating such microelectronic systems. In various embodiments, the method includes the step or process of obtaining a microelectronic component from which a heat dissipation post projects. The microelectronic component is placed or seated on a substrate, such as a multilayer printed circuit board, having a socket cavity therein. The heat dissipation post is received in the socket cavity as the microelectronic component is seated on the substrate. Concurrent with or after seating the microelectronic component, the microelectronic component and the heat dissipation post are bonded to the substrate. In certain embodiments, the heat dissipation post may be dimensioned or sized such that, when the microelectronic component is seated on the substrate, the heat dissipation post occupies a volumetric majority of the socket cavity.