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For the Inventor, By the Inventor

Gilbert, AZ, United States of America

Jaynal Abedin Molla

This inventor holds 40 USPTO granted patents and 2 published patent applications, primarily in Microelectronics Packaging. Top assignees: Nxp USA, Inc., Freescale Semiconductor,inc., Motorola Corporation. Active years: 2000-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jaynal Abedin Molla. Retrieved from https://idiyas.com/inventor/jaynal-abedin-molla

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 40 

% Patents Active = 85.0

Average Co-Inventor Count = 3.4

ph-index = 8

Forward Citations = 201(Granted Patents)


Location History:

  • Austin, TX (US) (2017)
  • Gilbert, AZ (US) (2000 - 2023)

Company Filing History:

goldMedal26 out of 2,846 
 
Nxp USA, Inc.
 patents
silverMedal10 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
bronzeMedal3 out of 20,290 
 
Motorola Corporation
 patents
4. 1 out of 358 
 
Everspin Technologies, Inc.
 patents

Years Active: 2000-2025

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Areas of Expertise:
Microelectronic Components
Thermal Interface
Sinter-Bonded Structures
Embedded Heat Dissipation
Magnetoresistive Devices
Wafer Dicing
Air Cavity Packages
Conductive Vias
Power Amplifier Packages
Metal Outer Layers
Copper Surface Processing
Dual-Metal Magnetic Shield
40 patents (USPTO):Explore Patents
1. 12482719 - Low-stress thermal interface (2025-11-25),
2. 12094801 - Thick-silver layer interface (2024-09-17),
3. 11749639 - Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods (2023-09-05),
4. 11616040 - Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods (2023-03-28),
5. 11437276 - Packaged dies with metal outer layers extending from die back sides toward die front sides (2022-09-06),
6. 11128268 - Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof (2021-09-21),
7. 10923451 - Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods (2021-02-16),
8. 10861764 - Microelectronic components having integrated heat dissipation posts and systems including the same (2020-12-08),
9. 10825747 - Semiconductor device package and methods of manufacture thereof (2020-11-03),
10. 10741446 - Method of wafer dicing for wafers with backside metallization and packaged dies (2020-08-11),
11. 10727153 - Thick-silver layer interface (2020-07-28),
12. 10529638 - Molded air cavity packages and methods for the production thereof (2020-01-07),
13. 10485091 - Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof (2019-11-19),
14. 10431449 - Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof (2019-10-01),
15. 10396006 - Molded air cavity packages and methods for the production thereof (2019-08-27),

Title: The Innovative Mind of Jaynal Abedin Molla

Introduction:

Jaynal Abedin Molla, a talented inventor based in Gilbert, AZ (US), is known for his groundbreaking contributions to the field of technology and innovation. With a passion for creating solutions to everyday problems, Molla has established himself as a prominent figure in the world of inventions.

Latest Patents:

Molla's latest patents showcase his ingenuity and forward-thinking approach to innovation. His recent inventions focus on enhancing efficiency in renewable energy systems and improving communication technologies for remote work environments.

Career Highlights:

Throughout his career, Jaynal Abedin Molla has demonstrated a remarkable ability to transform ideas into tangible inventions. His work has been recognized for its impact on various industries, ranging from sustainable energy to telecommunications. Molla's dedication to pushing the boundaries of innovation has earned him a reputation as a visionary inventor.

Collaborations:

Molla has collaborated with leading research institutions and technology companies to bring his inventions to life. His partnerships have been instrumental in advancing the development and implementation of his groundbreaking ideas. By working closely with experts in the field, Molla has been able to leverage their knowledge and resources to further his innovative projects.

Conclusion:

In conclusion, Jaynal Abedin Molla stands out as a prolific inventor whose creative spirit and dedication to innovation continue to inspire others in the industry. His passion for solving complex problems through inventive solutions has solidified his position as a trailblazer in the world of technology. Molla's

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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