Jaynal Abedin Molla

USPTO Granted Patents = 40 (Patent Applications = 2)

Average Co-Inventor Count = 3.4

ph-index = 8

Forward Citations = 199(Granted Patents)

Location History:

Austin, TX (US) (2017)
Gilbert, AZ (US) (2000 - 2023)

Company Filing History:

Freescale Semiconductor,inc.

Everspin Technologies, Inc.

patents

Years Active: 2000-2025

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40 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12482719 - Low-stress thermal interface (2025-11-25),

2. 12094801 - Thick-silver layer interface (2024-09-17),

3. 11749639 - Die-substrate assemblies having sinter-bonded backside via structures and associated fabrication methods (2023-09-05),

4. 11616040 - Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods (2023-03-28),

5. 11437276 - Packaged dies with metal outer layers extending from die back sides toward die front sides (2022-09-06),

6. 11128268 - Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof (2021-09-21),

7. 10923451 - Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods (2021-02-16),

8. 10861764 - Microelectronic components having integrated heat dissipation posts and systems including the same (2020-12-08),

9. 10825747 - Semiconductor device package and methods of manufacture thereof (2020-11-03),

10. 10741446 - Method of wafer dicing for wafers with backside metallization and packaged dies (2020-08-11),

11. 10727153 - Thick-silver layer interface (2020-07-28),

12. 10529638 - Molded air cavity packages and methods for the production thereof (2020-01-07),

13. 10485091 - Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof (2019-11-19),

14. 10431449 - Microelectronic systems containing embedded heat dissipation structures and methods for the fabrication thereof (2019-10-01),

15. 10396006 - Molded air cavity packages and methods for the production thereof (2019-08-27),

Title: The Innovative Mind of Jaynal Abedin Molla

Introduction:

Jaynal Abedin Molla, a talented inventor based in Gilbert, AZ (US), is known for his groundbreaking contributions to the field of technology and innovation. With a passion for creating solutions to everyday problems, Molla has established himself as a prominent figure in the world of inventions.

Latest Patents:

Molla's latest patents showcase his ingenuity and forward-thinking approach to innovation. His recent inventions focus on enhancing efficiency in renewable energy systems and improving communication technologies for remote work environments.

Career Highlights:

Throughout his career, Jaynal Abedin Molla has demonstrated a remarkable ability to transform ideas into tangible inventions. His work has been recognized for its impact on various industries, ranging from sustainable energy to telecommunications. Molla's dedication to pushing the boundaries of innovation has earned him a reputation as a visionary inventor.

Collaborations:

Molla has collaborated with leading research institutions and technology companies to bring his inventions to life. His partnerships have been instrumental in advancing the development and implementation of his groundbreaking ideas. By working closely with experts in the field, Molla has been able to leverage their knowledge and resources to further his innovative projects.

Conclusion:

In conclusion, Jaynal Abedin Molla stands out as a prolific inventor whose creative spirit and dedication to innovation continue to inspire others in the industry. His passion for solving complex problems through inventive solutions has solidified his position as a trailblazer in the world of technology. Molla's

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2 patents pending:

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