The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2020
Filed:
Mar. 07, 2019
Nxp Usa, Inc., Austin, TX (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Mahesh K. Shah, Scottsdale, AZ (US);
Lu Li, Gilbert, AZ (US);
David Abdo, Scottsdale, AZ (US);
Geoffrey Tucker, Tempe, AZ (US);
Carl Emil D'Acosta, Mesa, AZ (US);
Jaynal A. Molla, Gilbert, AZ (US);
Justin Eugene Poarch, Gilbert, AZ (US);
Paul Hart, Phoenix, AZ (US);
NXP USA, Inc., Austin, TX (US);
Abstract
Microelectronic systems and components having integrated heat dissipation posts are disclosed, as are methods for fabricating such microelectronic systems and components. In various embodiments, the microelectronic system includes a substrate having a frontside, a socket cavity, and inner cavity sidewalls defining the socket cavity. A microelectronic component is seated on the frontside of the substrate such that a heat dissipation post, which projects from the microelectronic component, is received in the socket cavity and separated from the inner cavity sidewalls by a peripheral clearance. The microelectronic system further includes a bond layer contacting the inner cavity sidewalls, contacting an outer peripheral portion of the heat dissipation post, and at least partially filling the peripheral clearance.