The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
May. 28, 2020
Nxp Usa, Inc., Austin, TX (US);
Sharan Kishore, Tempe, AZ (US);
Jaynal A. Molla, Gilbert, AZ (US);
Lakshminarayan Viswanathan, Phoenix, AZ (US);
Tianwei Sun, Chandler, AZ (US);
David James Dougherty, Tempe, AZ (US);
NXP USA, Inc., Austin, TX (US);
Abstract
Power amplifier (PA) packages containing peripherally-encapsulated dies are provided, as are methods for fabricating such PA packages. In embodiments, a method for fabricating a PA package includes obtaining a die-substrate assembly containing a radio frequency (RF) power die, a package substrate, and a die bond layer. The die bond layer is composed of at least one metallic constituent and electrically couples a backside of the RF power die to the package substrate. A peripheral encapsulant body is formed around the RF power die and covers at least a portion of the die bond layer, while leaving at least a majority of a frontside of the RF power die uncovered. Before or after forming the peripheral encapsulant body, terminals of the PA package are interconnected with the RF power die; and a cover piece is bonded to the die-substrate assembly to enclose a gas-containing cavity within the PA package.