David James Dougherty

USPTO Granted Patents = 12 (Patent Applications = 3)

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 72(Granted Patents)

Company Filing History:

Freescale Semiconductor,inc.

patents

Years Active: 1997-2024

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12 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12087671 - Overmolded microelectronic packages containing knurled flanges and methods for the production thereof (2024-09-10),

2. 11621673 - Power amplifier packages and systems incorporating design-flexible package platforms (2023-04-04),

3. 11196390 - Power amplifier devices containing frontside heat extraction structures and methods for the fabrication thereof (2021-12-07),

4. 11128268 - Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof (2021-09-21),

5. 10998255 - Overmolded microelectronic packages containing knurled flanges and methods for the production thereof (2021-05-04),

6. 10573594 - Semiconductor package design providing reduced electromagnetic coupling between circuit components (2020-02-25),

7. 9312817 - Semiconductor package design providing reduced electromagnetic coupling between circuit components (2016-04-12),

8. 7989951 - Die assemblies (2011-08-02),

9. 7332414 - Chemical die singulation technique (2008-02-19),

10. 7042103 - Low stress semiconductor die attach (2006-05-09),

11. 5889658 - Package assembly for an electronic component (1999-03-30),

12. 5659950 - Method of forming a package assembly (1997-08-26),

Title: The Innovative Contributions of David James Dougherty

Introduction

David James Dougherty is a prominent inventor based in Tempe, AZ (US), known for his significant contributions to the field of microelectronics. With a total of 12 patents to his name, Dougherty has made remarkable advancements in the design and production of microelectronic packages.

Latest Patents

Among his latest patents is the invention of overmolded microelectronic packages containing knurled flanges and methods for their production. This innovation provides a molded package body that houses at least one microelectronic device, bonded to a base flange featuring a knurled surface region. This design minimizes the risk of delamination between the molded package body and the base flange. Another notable patent involves power amplifier packages and systems that utilize design-flexible package platforms. This invention includes a package body with strategically placed input and output leads, enhancing the performance and reliability of power amplifier systems.

Career Highlights

Dougherty has worked with several notable companies throughout his career, including NXP USA, Inc. and Motorola Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the microelectronics sector.

Collaborations

Throughout his career, Dougherty has collaborated with esteemed colleagues such as Lakshminarayan Viswanathan and Peter H Aaen. These partnerships have fostered innovation and have led to the development of advanced technologies in the field.

Conclusion

David James Dougherty's contributions to microelectronics through his patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the design and functionality of microelectronic devices, showcasing the importance of innovation in technology.

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3 patents pending:

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