The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 04, 2023

Filed:

Mar. 26, 2020
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Jean-Christophe Nanan, Toulouse, FR;

David James Dougherty, Tempe, AZ (US);

Scott Duncan Marshall, Chandler, AZ (US);

Lakshminarayan Viswanathan, Phoenix, AZ (US);

Xavier Hue, Frouzins, FR;

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/14 (2006.01); H03F 1/02 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H03F 3/21 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0288 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H03F 3/211 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/49175 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01);
Abstract

Embodiments of Doherty Power Amplifier (PA) and other PA packages are provided, as are systems including PA packages. In embodiments, the PA package includes a package body having a longitudinal axis, a first group of input-side leads projecting from a first side of the package body and having an intra-group lead spacing, and a first group of output-side leads projecting from a second side of the package body and also having the intra-group lead spacing. A first carrier input lead projects from the first package body side and is spaced from the first group of input-side leads by an input-side isolation gap, which has a width exceeding the intra-group lead spacing. Similarly, a first carrier output lead projects from the second package body side, is laterally aligned with the first carrier input lead, and is separated from the first group of output-side leads by an output-side isolation gap.


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