The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2017

Filed:

Aug. 21, 2013
Applicants:

Lakshminarayan Viswanathan, Phoenix, AZ (US);

Jaynal A. Molla, Gilbert, AZ (US);

Mahesh K. Shah, Scottsdale, AZ (US);

Inventors:

Lakshminarayan Viswanathan, Phoenix, AZ (US);

Jaynal A. Molla, Gilbert, AZ (US);

Mahesh K. Shah, Scottsdale, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 1/18 (2006.01); B23K 1/20 (2006.01); H05K 1/14 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B23K 1/20 (2013.01); H05K 1/141 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01); H05K 1/056 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10553 (2013.01); H05K 2203/1173 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49144 (2015.01); Y10T 428/12389 (2015.01);
Abstract

An embodiment of a solder wettable flange includes a flange body formed from a conductive material. The flange body has a bottom surface, a top surface, sidewalls extending between the top surface and the bottom surface, and one or more depressions extending into the flange body from the bottom surface. Each depression is defined by a depression surface that may or may not be solder wettable. During solder attachment of the flange to a substrate, the depressions may function as reservoirs for excess solder. Embodiments also include devices and systems that include such solder wettable flanges, and methods for forming the solder wettable flanges, devices, and systems.


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