Growing community of inventors

Tempe, AZ, United States of America

Audel Sanchez

Average Co-Inventor Count = 3.78

ph-index = 6

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 84

Audel SanchezLakshminarayan Viswanathan (20 patents)Audel SanchezFernando A Santos (15 patents)Audel SanchezJerry Lynn White (7 patents)Audel SanchezJaynal Abedin Molla (4 patents)Audel SanchezJose Luis Suarez (4 patents)Audel SanchezMichele Lynn Miera (3 patents)Audel SanchezJin-Wook Jang (3 patents)Audel SanchezLalgudi M Mahalingam (3 patents)Audel SanchezLi Li (2 patents)Audel SanchezRamanujam Srinidhi Embar (2 patents)Audel SanchezMahesh K Shah (2 patents)Audel SanchezHussain Hasanali Ladhani (2 patents)Audel SanchezVikas Shilimkar (2 patents)Audel SanchezDavid James Dougherty (2 patents)Audel SanchezLakshmi Narayan Ramanathan (2 patents)Audel SanchezFrank Danaher (2 patents)Audel SanchezHamdan Ismail (2 patents)Audel SanchezAruna Manoharan (2 patents)Audel SanchezMichael L Eleff (2 patents)Audel SanchezRobert A Pryor (1 patent)Audel SanchezDavid F Abdo (1 patent)Audel SanchezTaek K Kim (1 patent)Audel SanchezGabriela Michel Sanchez (1 patent)Audel SanchezFlavio Hernandez Rodriguez (1 patent)Audel SanchezAudel Sanchez (28 patents)Lakshminarayan ViswanathanLakshminarayan Viswanathan (89 patents)Fernando A SantosFernando A Santos (31 patents)Jerry Lynn WhiteJerry Lynn White (11 patents)Jaynal Abedin MollaJaynal Abedin Molla (40 patents)Jose Luis SuarezJose Luis Suarez (6 patents)Michele Lynn MieraMichele Lynn Miera (9 patents)Jin-Wook JangJin-Wook Jang (7 patents)Lalgudi M MahalingamLalgudi M Mahalingam (3 patents)Li LiLi Li (36 patents)Ramanujam Srinidhi EmbarRamanujam Srinidhi Embar (26 patents)Mahesh K ShahMahesh K Shah (24 patents)Hussain Hasanali LadhaniHussain Hasanali Ladhani (19 patents)Vikas ShilimkarVikas Shilimkar (16 patents)David James DoughertyDavid James Dougherty (12 patents)Lakshmi Narayan RamanathanLakshmi Narayan Ramanathan (9 patents)Frank DanaherFrank Danaher (5 patents)Hamdan IsmailHamdan Ismail (3 patents)Aruna ManoharanAruna Manoharan (3 patents)Michael L EleffMichael L Eleff (2 patents)Robert A PryorRobert A Pryor (18 patents)David F AbdoDavid F Abdo (18 patents)Taek K KimTaek K Kim (1 patent)Gabriela Michel SanchezGabriela Michel Sanchez (1 patent)Flavio Hernandez RodriguezFlavio Hernandez Rodriguez (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Nxp Usa, Inc. (15 from 2,689 patents)

2. Freescale Semiconductor,inc. (13 from 5,491 patents)


28 patents:

1. 12087671 - Overmolded microelectronic packages containing knurled flanges and methods for the production thereof

2. 11343919 - Packaged electronic devices with top terminations

3. 10998255 - Overmolded microelectronic packages containing knurled flanges and methods for the production thereof

4. 10861774 - Internally-shielded microelectronic packages and methods for the fabrication thereof

5. 10629518 - Internally-shielded microelectronic packages and methods for the fabrication thereof

6. 10529638 - Molded air cavity packages and methods for the production thereof

7. 10396006 - Molded air cavity packages and methods for the production thereof

8. 10375833 - Methods of manufacturing packaged electronic devices with top terminations

9. 10241151 - Die crack detector and method therefor

10. 10199302 - Molded air cavity packages and methods for the production thereof

11. 10199303 - Molded air cavity packages and methods for the production thereof

12. 10141227 - Method and system for achieving semiconductor-based circuits or systems having multiple components with one or more matched or similar characteristics or features

13. 9986646 - Packaged electronic devices with top terminations, and methods of manufacture thereof

14. 9800208 - Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

15. 9646897 - Die crack detector with integrated one-time programmable element

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