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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9922894 B1

PDFFull Text
Date of Patent:
Mar. 20, 2018

Filed:

Sep. 19, 2016

Air cavity packages and methods for the production thereof

Applicant:

Freescale Semiconductor Inc., Austin, TX (US);

Inventors:

Lakshminarayan Viswanathan, Phoenix, AZ (US);

Jaynal A. Molla, Gilbert, AZ (US);

David Abdo, Scottsdale, AZ (US);

Mali Mahalingam, Scottsdale, AZ (US);

Carl D'Acosta, Mesa, AZ (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:

Evan Pert

Assistant Examiner:

Changhyun Yi

Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/66 (2006.01); H01L 23/20 (2006.01); H01L 23/047 (2006.01); H01L 21/48 (2006.01); H01L 23/057 (2006.01); H01L 23/367 (2006.01); B22F 3/10 (2006.01); B22F 1/00 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/20 (2013.01); B22F 1/0062 (2013.01); B22F 3/10 (2013.01); B23K 35/025 (2013.01); B23K 35/30 (2013.01); H01L 21/4817 (2013.01); H01L 23/047 (2013.01); H01L 23/057 (2013.01); H01L 23/3675 (2013.01); B22F 2301/10 (2013.01); B22F 2301/255 (2013.01); B22F 2302/45 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Air cavity packages and methods for producing air cavity packages containing sintered bonded components, multipart window frames, and/or other unique structural features are disclosed. In one embodiment, a method for fabricating an air cavity package includes the step or process of forming a first metal particle-containing precursor layer between a base flange and a window frame positioned over the base flange. A second metal particle-containing precursor layer is further formed between the base flange and a microelectronic device positioned over the base flange. The metal particle-containing precursor layers are sintered substantially concurrently at a maximum processing temperature less than melt point(s) of metal particles within the layers to produce a first sintered bond layer from the first precursor layer joining the window frame to the base flange and to produce a second sintered bond layer from the second precursor layer joining the microelectronic device to the base flange.

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